Innovative abatement solutions
The Burn Wet point-of-use abatement is a highly efficient system used in CVD and etching applications for photovoltaic, semiconductor, and related industries.
| Model | Channel | Total Capacity (LPM) | DRE (%) | Combustible Gas | Water Soluble Gas | PFC Gas | Process |
|---|---|---|---|---|---|---|---|
| EBW-600S | Single | 600 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |
| EBW-1000S | Single | 1000 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |
| EBW-1500S | Single | 1500 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |
| EBW-3000S | Single | 3000 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |
| EBW-600D | Dual | 600 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |
| EBW-800D | Dual | 800 | >= 99% | AsH₃, B₂H₆, DCS, GeH₄, H₂, PH₃, SiH₄, Si₂H₆, TEB, TEOS | BCl₃, Cl₂, HF, HCl, HBr, NH₃, WF₆ | CF₄, C₂F₆, C₃F₈, NF₃, SF₆ | ETCH, CVD, METAL, DIFF |